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| LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only ROUND TYPE LED LAMPS Pb Lead-Free Parts LSGM3333-PF DATA SHEET DOC. NO : REV. DATE : : QW0905- LSGM3333-PF A 23 - May - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSGM3333-PF Page 1/5 Package Dimensions 5.0 5.9 7.6 8.6 1.5 MAX 25.0MIN 1/4 0.5 TYP 2.54TYP 1.0MIN Note : 1.All dimension are in millimeter tolerance is O 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSGM3333-PF Page 2/5 Absolute Maximum Ratings at Ta=25 J Ratings Parameter Symbol SGM Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge Operating Temperature Storage Temperature Soldering Temperature IF IFP PD Ir ESD Topr Tstg Tsol 30 100 100 50 1000 -20 ~ +80 -30 ~ +100 Max 260J for 5 sec Max (2mm from body) mA mA mW UNIT g A V J J Typical Electrical & Optical Characteristics (Ta=25 J) COLOR PART NO MATERIAL Emitted Lens Luminous Peak Dominant Spectral Forward wave intensity wave halfwidth voltage length length f nm @20mA(V) @20mA(mcd) f P nm f D nm Viewing angle 2c 1/2 (deg) Typ. Max. Min. 518 525 35 3.5 Typ. 12 LSGM3333-PF InGaN/SiC Green Water Clear 4.2 1500 2700 Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSGM3333-PF Page 3/5 Typical Electro-Optical Characteristics Curve SGM CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Forward Current vs. Relative Intensity 2.5 30 Forward Current(mA) Forward Current(mA) 1.0 1.5 2.5 3.5 2.0 1.5 1.0 0.5 0.0 20 10 0 2.0 3.0 4.0 0 10 20 30 40 50 Forward Voltage(V) Fig.3 Forward Current vs. Temperature 60 50 40 30 20 10 0 0 20 40 60 80 100 Relative Intensity Normalize @20mA Fig.4 Relative Intensity vs. Temperature 2.0 Relative Intensity@20mA Normalize @25J Forward Current@20mA 1.5 1.0 0.5 0.0 20 30 40 50 60 70 Ambient Temperature(J) Ambient Temperature(J) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 1.0 0.5 0.0 450 500 550 600 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSGM3333-PF Page 4/5 Wave soldering Profile Temp(XC) 245 C 5sec Max 245X 5/sec max 3/sec max Preheat Soldering Soldering Iron:30W Max Temperature 300 C Max Soldering Time:3 Seconds Max Distance:2mm Min(From solder joint to case) 120X 25X Dip Soldering Preheat: 120 C Max Time(sec) Preheat time: 120 seconds Max Ramp-up 3 C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:245 C Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to case) Wave Soldering Profile (Pb Free) Temp(XC) 265C 5sec Max 265X Soldering Soldering Iron:30W Max Temperature:350 CMax Soldering Time:3seconds Max Distance:2mm Min(From solder joint to case) 140X 3 /sec max Preheat 120 Seconds Max 5/sec max 25X Dip Soldering Preheat: 140C Max Preheat time: 120seconds Max Time(sec) Ramp-up 3C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:265 C Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to case) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSGM3333-PF Page 5/5 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=105 JO 5J 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 JO 5J 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 JO 5J 2.RH=90 %~95% 3.t=240hrs O 2hrs The purpose of this test is the resistance of the device under tropical for hous. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 JO 5J&-40JO 5J (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 JO 5J 2.Dwell time= 10 O 1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 JO 5J 2.Dwell time=5 O 1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 PACKING SPECIFICATION 1. 500PCS / BAG 2. 10 BAG / INNER BOX SIZE : L X W X H 33cm X 19cm X 8cm L W H 3. 12 INNER BOXES / CARTON SIZE : L X W X H 58cm X 34cm X 34cm L W C/NO: MADE IN CHINA . NO M IT E Y : Q'T ,: W: N, , W G, S PC gs k s kg H |
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